HARMAN teams up with leading OEMs to bring new in-car audio experiences to IAA 2019

Sep 13, 2019    Tier Suppliers

HARMAN is gearing up to present its best-in-class audio technologies and solutions for many of the world’s foremost automotive OEMs at IAA 2019 from September 12-22 in Frankfurt/Main.

HRC and Voith Composites co-develop hydrogen high pressure vessels for fuel cell applications

Sep 12, 2019    Tier Suppliers

Voith Composites and HRC, a leading composite solution provider, will jointly work on the next generation of hydrogen high pressure vessels for fuel cell electric vehicles (FCEV).

New Teijin resin compound plant and technical centre open in Thailand

Sep 11, 2019    Tier Suppliers

Teijin Limited has announced that it has commenced operations of its ASEAN compound plant and technical centre at Teijin Corporation (Thailand) Limited in Bang Pa-in Industrial Estate, Ayutthaya, Thailand.

Hella shows lighting and electronic solutions at Frankfurt Auto show

Sep 11, 2019    Tier Suppliers

"Exceed Possibilities" – this is the motto of the globally positioned automotive supplier HELLA at this year's IAA in Frankfurt.

STMicroelectronics to supply advanced silicon-carbide power electronics to Renault-Nissan-Mitsubishi

Sep 10, 2019    Tier Suppliers

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, has been chosen to supply high-efficiency silicon-carbide (SiC) power electronics by Renault-Nissan-Mitsubishi (Alliance) for advanced on-board chargers (OBCs) in its upcoming electric vehicles.

BENTELER collaborates with car manufacturers to implement its Electric Drive System

Sep 10, 2019    Tier Suppliers

Since BENTELER presented its Electric Drive System 2.0 to a broad audience for the first time in April 2019 at Auto Shanghai, it has gained traction.

Delphi partners with Cree for automotive silicon carbide devices

Sep 10, 2019    Tier Suppliers

Delphi Technologies PLC, a global provider of automotive propulsion technologies, and Cree, Inc., a leader in silicon carbide semiconductors, announced a partnership to utilise silicon carbide semiconductor device technology to enable faster, smaller, lighter and more powerful electronic systems for future electric vehicles.

Continental to present a high-performance platform for the vehicle cockpit of tomorrow

Sep 6, 2019    Tier Suppliers

At the IAA 2019 in Frankfurt, Continental will be presenting the latest version of its Integrated Interior Platform (IIP).

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